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XPG LANCER BLADE memory module 32 GB 2 x 16 GB DDR5 ECC
In Stock
79 available
- DDR5
- 5600 MHz
- 2 x 16 GB
- 133.35 x 33.8 x 7.8 mm
SKU #: AX5U5600C4616G-DTLABBK
EAN #: 4711085945457
UNSPSC #: 43201402
| Internal memory type | DDR5 |
|---|---|
| Memory clock speed | 5600 MHz |
| ECC | Yes |
| Component for | PC |
| SKU | AX5U5600C4616G-DTLABBK |
| EAN | 4711085945457 |
| Manufacturer | ADATA |
| Availability | In Stock |
| Product Family | LANCER BLADE |
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| CAS latency | 45 |
| Memory voltage | 1.1,1.4 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Power | |
| Memory voltage | 1.1,1.4 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
|---|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| CAS latency | 45 |
| Memory voltage | 1.1,1.4 V |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Weight & dimensions | |
| Width | 33.8 mm |
| Depth | 133.3 mm |
| Height | 7.8 mm |
| Weight | 32.9 g |
| Package type | Blister |
| Packaging data | |
| Package type | Blister |
LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| CAS latency | 45 |
| Memory voltage | 1.1,1.4 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Power | |
| Memory voltage | 1.1,1.4 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
|---|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| CAS latency | 45 |
| Memory voltage | 1.1,1.4 V |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Weight & dimensions | |
| Width | 33.8 mm |
| Depth | 133.3 mm |
| Height | 7.8 mm |
| Weight | 32.9 g |
| Package type | Blister |
| Packaging data | |
| Package type | Blister |
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|---|---|---|---|---|---|---|
| SKU |
AX5U5600C4616G-DTLABBK
|
P00922-B21
|
1XD85AA
|
KTL-TS432/32G
|
D4ES02-8G
|
KF556C36BBEK2-32
|
| Manufacturer |
ADATA
|
HPE
|
HPE
|
Kingston Technology
|
Synology
|
Kingston Technology
|
| Internal memory type |
DDR5
|
DDR4
|
DDR4
|
DDR4
|
DDR4
|
DDR5
|
| ECC |
Y
|
N/A
|
N/A
|
Y
|
Y
|
N
|
| Memory form factor |
N/A
|
RDIMM
|
288-pin DIMM
|
288-pin DIMM
|
260-pin SO-DIMM
|
288-pin DIMM
|
| Component for |
PC
|
PC/server
|
PC/server
|
PC/server
|
PC/server
|
PC
|
| Internal memory |
32GB
|
16GB
|
16GB
|
32GB
|
8GB
|
32GB
|
| Memory layout (modules x size) |
2 x 16 GB
|
1 x 16 GB
|
1 x 16 GB
|
1 x 32 GB
|
1 x 8 GB
|
2 x 16 GB
|