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AMD EPYC 75F3 processor 2.95 GHz 256 MB L3
In Stock
1 available
- 32 cores
- 64 threads
- 2.95 GHz base frequency
- 4.0GHz boost frequency
- 256MB L3 cache
SKU #: 100-000000313
EAN #: 8592978331757
UNSPSC #: 43201503
Processor socket | Socket SP3 |
---|---|
Processor cores | 32 |
Processor family | AMD EPYC |
SKU | 100-000000313 |
EAN | 8592978331757 |
Manufacturer | AMD |
Availability | In Stock |
Product Family | EPYC |
Processor | |
---|---|
Processor base frequency | 2.95 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 280 W |
Processor cache | 256 MB |
Processor model | 75F3 |
Processor threads | 64 |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 32 |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
---|---|
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.95 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 280 W |
Processor cache | 256 MB |
Processor model | 75F3 |
Processor threads | 64 |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 32 |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
---|---|
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
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---|---|---|---|---|---|---|
SKU |
100-000000313
|
100-000000053
|
CD8069504449000
|
100-000000345
|
CD8068904657502
|
CD8068904665802
|
Manufacturer |
AMD
|
AMD
|
Intel
|
AMD
|
Intel
|
Intel
|
Processor lithography |
N/A
|
up to 22nm
|
up to 22nm
|
N/A
|
up to 22nm
|
up to 22nm
|
Processor family |
AMD EPYC
|
AMD EPYC
|
Intel Xeon Gold
|
AMD EPYC
|
Intel Xeon Gold
|
Intel Xeon Gold
|
Processor socket |
Socket SP3
|
Socket SP3
|
LGA 3647 (Socket P)
|
Socket SP3
|
LGA 4189
|
LGA 4189
|
Processor cores |
32
|
64
|
16
|
32
|
16
|
8
|
On-board graphics card |
N/A
|
N
|
N
|
N/A
|
N
|
N
|
Discrete graphics card |
N/A
|
N
|
N
|
N/A
|
N
|
N
|
Cooler included |
N/A
|
N
|
N
|
N/A
|
N
|
N
|
Package type |
N/A
|
Tray
|
Retail box
|
N/A
|
Tray
|
Tray
|