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AMD EPYC 7313 processor 3 GHz 128 MB L3 Tray

In Stock

1 available

16 cores
32 threads
3GHz base clock
3.7GHz boost clock
128MB L3 cache

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SKU #: 100-000000329

EAN #: 8592978306618

UNSPSC #: 43201503

More Information

Tech Specs

Description

Specifications

More Information
Processor socket	Socket SP3
Box	No
Processor cores	16
Processor family	AMD EPYC
SKU	100-000000329
EAN	8592978306618
Manufacturer	AMD
Availability	In Stock
Product Family	EPYC

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	180 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	180 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000329	CD8069503956900	100-000000076	100-000000045	100-000000046	100-000000057
Manufacturer	AMD	Intel	AMD	AMD	AMD	AMD
Processor lithography	N/A	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon Silver	AMD EPYC	AMD EPYC	AMD EPYC	AMD EPYC
Processor socket	Socket SP3	LGA 3647 (Socket P)	Socket SP3	Socket SP3	Socket SP3	Socket SP3
Processor cores	16	8	48	32	24	32
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N	N	N	N	N
Cooler included	N	N	N	N	N	N
Package type	Tray	Tray	Tray	Tray	Tray	Tray