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HPE Xeon Intel -Platinum 8352M 2.3GHz 32-core 185W Processor for
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- Intel Xeon-Platinum 8352M 2.3GHz 32-core 185W Processor for HPE
SKU #: P45414-B21
EAN #: 0190017552309
UNSPSC #: 43201503
Processor socket | LGA 4189 |
---|---|
Box | No |
Processor cores | 32 |
Processor family | Intel Xeon Platinum |
SKU | P45414-B21 |
EAN | 0190017552309 |
Manufacturer | HPE |
Availability | Out of Stock |
Product Family | Xeon |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 185 W |
Processor cache | 48 MB |
Processor model | 8352M |
Processor threads | 64 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Platinum |
Processor cores | 32 |
Processor socket | LGA 4189 |
Processor cache type | L3 |
Package type | Tray |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 185 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 185 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 185 W |
Processor package size | 77.5 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
---|---|
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 77 °C |
Packaging data | |
Package type | Tray |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
.
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 185 W |
Processor cache | 48 MB |
Processor model | 8352M |
Processor threads | 64 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Platinum |
Processor cores | 32 |
Processor socket | LGA 4189 |
Processor cache type | L3 |
Package type | Tray |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 185 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 185 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 185 W |
Processor package size | 77.5 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
---|---|
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 77 °C |
Packaging data | |
Package type | Tray |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |