This site uses cookies and other tracking technologies to assist with navigation and your ability to provide feedback, analyse your use of our site and services and assist with our promotional and marketing efforts. You can read more about this in our Privacy Policy.
HPE Xeon Intel -Gold 5317 3.0GHz 12-core 150W Processor Kit for ProLiant XL2x0n Gen10 Plus
xOut of Stock
Contact your account manager
- Intel Xeon-Gold 5317 3.0GHz 12-core 150W Processor Kit for HPE ProLiant XL2x0n Gen10 Plus
SKU #: P36806-B21
EAN #: 0190017497518
UNSPSC #: 43201503
Processor socket | LGA 4189 |
---|---|
Processor cores | 12 |
Processor family | Intel Xeon Gold |
Processor lithography | 10 nm |
SKU | P36806-B21 |
EAN | 0190017497518 |
Manufacturer | HPE |
Availability | Out of Stock |
Product Family | Xeon |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Thermal Design Power (TDP) | 150 W |
Processor cache | 18 MB |
Processor model | 5317 |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 4189 |
Processor series | Intel Xeon Gold 5000 Series |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
---|---|
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Processor special features | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Weight & dimensions | |
Width | 174.8 mm |
Weight | 700 g |
Height | 169.7 mm |
Depth | 285.7 mm |
.
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Thermal Design Power (TDP) | 150 W |
Processor cache | 18 MB |
Processor model | 5317 |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 4189 |
Processor series | Intel Xeon Gold 5000 Series |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
---|---|
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Processor special features | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Weight & dimensions | |
Width | 174.8 mm |
Weight | 700 g |
Height | 169.7 mm |
Depth | 285.7 mm |