HPE AMD EPYC 7473X 2.8GHz 24-core 240W Processor for

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  • AMD EPYC 7473X 2.8GHz 24-core 240W Processor for HPE
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SKU #: P46924-B21
EAN #: 0190017589428
UNSPSC #: 43201503
More Information
Processor socket Socket SP3
Box No
Processor cores 24
Processor family AMD EPYC
SKU P46924-B21
EAN 0190017589428
Manufacturer HPE
Availability Out of Stock
Processor
Processor base frequency2.8 GHz
Processor manufacturerAMD
Cooler includedNo
Configurable TDP-down225 W
Thermal Design Power (TDP)240 W
Processor cache768 MB
Processor model7473X
Processor threads48
Processor boost frequency3.7 GHz
Processor familyAMD EPYC
Processor cores24
Processor socketSocket SP3
Configurable TDP-up280 W
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Configurable TDP-down225 W
Thermal Design Power (TDP)240 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)240 W
Market segmentServer
Configurable TDP-up280 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)240 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up280 W
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
.
Processor
Processor base frequency2.8 GHz
Processor manufacturerAMD
Cooler includedNo
Configurable TDP-down225 W
Thermal Design Power (TDP)240 W
Processor cache768 MB
Processor model7473X
Processor threads48
Processor boost frequency3.7 GHz
Processor familyAMD EPYC
Processor cores24
Processor socketSocket SP3
Configurable TDP-up280 W
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Configurable TDP-down225 W
Thermal Design Power (TDP)240 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)240 W
Market segmentServer
Configurable TDP-up280 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)240 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up280 W
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119