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Kingston Technology KF316C10BBK2/8 memory module 8 GB 2 x 4 GB DDR3 240-pin DIMM
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- 8 GB
- DDR3-1600
- CL10
- 240-Pin
- DIMM
SKU #: KF316C10BBK2/8
EAN #: 0740617318142
UNSPSC #: 43201402
- JEDEC standard 1.5V Power Supply
- VDDQ = 1.5V
- 800MHz fCK for 1600Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6
- Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- Height 1.338” (34mm) w/heatsink
| Internal memory type | DDR3 |
|---|---|
| Memory clock speed | 1600 MHz |
| ECC | No |
| Memory form factor | 240-pin DIMM |
| SKU | KF316C10BBK2/8 |
| EAN | 0740617318142 |
| Manufacturer | Kingston Technology |
| Availability | Out of Stock |
| PDF URLs |
View PDF |
| Power | |
|---|---|
| Memory voltage | 1.5 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 240-pin DIMM |
| CAS latency | 10 |
| Memory voltage | 1.5 V |
| Module configuration | 512M x 64 |
| Row cycle time | 48.125 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 37.5 ns |
| Memory channels | Dual-channel |
| ECC | No |
| Internal memory type | DDR3 |
| Features | |
| Backlight | No |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 240-pin DIMM |
| CAS latency | 10 |
| Memory voltage | 1.5 V |
| Module configuration | 512M x 64 |
| Row cycle time | 48.125 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 37.5 ns |
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Memory channels | Dual-channel |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR3 |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| System requirements | |
|---|---|
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Software | |
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Weight & dimensions | |
| Width | 133.3 mm |
| Depth | 7.1 mm |
| Height | 34 mm |
| Logistics data | |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
FURY KF316C10BBK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Total kit capacity is 8GB. Each module has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. Each 240-pin DIMM uses gold contact fingers.
| Power | |
|---|---|
| Memory voltage | 1.5 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 240-pin DIMM |
| CAS latency | 10 |
| Memory voltage | 1.5 V |
| Module configuration | 512M x 64 |
| Row cycle time | 48.125 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 37.5 ns |
| Memory channels | Dual-channel |
| ECC | No |
| Internal memory type | DDR3 |
| Features | |
| Backlight | No |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 240-pin DIMM |
| CAS latency | 10 |
| Memory voltage | 1.5 V |
| Module configuration | 512M x 64 |
| Row cycle time | 48.125 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 37.5 ns |
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Memory channels | Dual-channel |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR3 |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| System requirements | |
|---|---|
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Software | |
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Weight & dimensions | |
| Width | 133.3 mm |
| Depth | 7.1 mm |
| Height | 34 mm |
| Logistics data | |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |