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Cisco AMD EPYC 9355P processor 3.55 GHz 256 MB L3 Tray
xOut of Stock
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- Socket SP5
- 32 cores
- 64 threads
- 3.55 GHz base clock
- 4.4 GHz boost clock
SKU #: UCS-CPU-A9355P
UNSPSC #: 43201503
| SKU | UCS-CPU-A9355P |
|---|---|
| Manufacturer | Cisco |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor base frequency | 3.55 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 240 W |
| Thermal Design Power (TDP) | 280 W |
| Processor cache | 256 MB |
| Processor model | 9355P |
| Processor threads | 64 |
| Processor boost frequency | 4.4 GHz |
| Processor family | AMD EPYC |
| Processor cores | 32 |
| Processor socket | Socket SP5 |
| Configurable TDP-up | 300 W |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR5-SDRAM |
| Memory channels | Dodeca-channel |
| Memory bandwidth (max) | 576 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 240 W |
| Thermal Design Power (TDP) | 280 W |
| Technical details | |
|---|---|
| PCI Express slots version | 5.0 |
| Thermal Design Power (TDP) | 280 W |
| Market segment | Server |
| Configurable TDP-up | 300 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 280 W |
| PCI Express slots version | 5.0 |
| Market segment | Server |
| Processor special features | |
| Configurable TDP-up | 300 W |
| Packaging data | |
| Package type | Tray |
| Processor | |
|---|---|
| Processor base frequency | 3.55 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 240 W |
| Thermal Design Power (TDP) | 280 W |
| Processor cache | 256 MB |
| Processor model | 9355P |
| Processor threads | 64 |
| Processor boost frequency | 4.4 GHz |
| Processor family | AMD EPYC |
| Processor cores | 32 |
| Processor socket | Socket SP5 |
| Configurable TDP-up | 300 W |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR5-SDRAM |
| Memory channels | Dodeca-channel |
| Memory bandwidth (max) | 576 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 240 W |
| Thermal Design Power (TDP) | 280 W |
| Technical details | |
|---|---|
| PCI Express slots version | 5.0 |
| Thermal Design Power (TDP) | 280 W |
| Market segment | Server |
| Configurable TDP-up | 300 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 280 W |
| PCI Express slots version | 5.0 |
| Market segment | Server |
| Processor special features | |
| Configurable TDP-up | 300 W |
| Packaging data | |
| Package type | Tray |