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AMD EPYC 7343 processor 3.2 GHz 128 MB L3
In Stock
1 available
- 16 cores
- 32 threads
- 3.2 GHz base frequency
- 3.9 GHz boost frequency
- 128MB L3 cache
SKU #: 100-000000338
EAN #: 8592978333195
UNSPSC #: 43201503
| Processor socket | Socket SP3 |
|---|---|
| Processor cores | 16 |
| Processor family | AMD EPYC |
| SKU | 100-000000338 |
| EAN | 8592978333195 |
| Manufacturer | AMD |
| Availability | In Stock |
| Product Family | EPYC |
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Processor cache | 128 MB |
| Processor model | 7343 |
| Processor threads | 32 |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Technical details | |
|---|---|
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 190 W |
| Market segment | Server |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 190 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 200 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Processor cache | 128 MB |
| Processor model | 7343 |
| Processor threads | 32 |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Technical details | |
|---|---|
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 190 W |
| Market segment | Server |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 190 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 200 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
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|---|---|---|---|---|---|---|
| SKU |
100-000000338
|
CD8069503956900
|
100-000000076
|
100-000000045
|
100-000000046
|
100-000000057
|
| Manufacturer |
AMD
|
Intel
|
AMD
|
AMD
|
AMD
|
AMD
|
| Processor lithography |
N/A
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
| Processor family |
AMD EPYC
|
Intel Xeon Silver
|
AMD EPYC
|
AMD EPYC
|
AMD EPYC
|
AMD EPYC
|
| Processor socket |
Socket SP3
|
LGA 3647 (Socket P)
|
Socket SP3
|
Socket SP3
|
Socket SP3
|
Socket SP3
|
| Processor cores |
16
|
8
|
48
|
32
|
24
|
32
|
| On-board graphics card |
N/A
|
N
|
N
|
N
|
N
|
N
|
| Discrete graphics card |
N/A
|
N
|
N
|
N
|
N
|
N
|
| Cooler included |
N/A
|
N
|
N
|
N
|
N
|
N
|
| Package type |
N/A
|
Tray
|
Tray
|
Tray
|
Tray
|
Tray
|