AMD EPYC 7313P processor 3 GHz 128 MB L3

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3 available
  • 16 cores
  • 32 threads
  • 3.0 GHz base frequency
  • 3.7 GHz boost frequency
  • 128MB L3 cache
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SKU #: 100-000000339
EAN #: 8592978317959
UNSPSC #: 43201503

AMD EPYC 7313P – Optimized Power for Modern Servers
Deliver high-efficiency processing with the AMD EPYC 7313P, designed to strike the perfect balance between performance, scalability, and reliability in enterprise-grade server deployments.

Octa-Channel Memory for Maximum Bandwidth
With eight DDR4 memory channels supporting up to 3200 MHz, the EPYC 7313P provides massive bandwidth to meet the demands of virtualization, high-performance computing, and intensive data processing.

Socket SP3 Compatibility for Infrastructure Stability
Engineered for full compatibility with AMD's robust SP3 ecosystem, this processor easily integrates with proven server platforms—delivering consistency, efficiency, and thermal reliability.

Built for the Server Market Segment
Optimized specifically for modern data center workloads, the EPYC 7313P is your go-to choice for cloud-native applications, virtualization, and enterprise IT environments.

Trusted AMD Architecture for Mission-Critical Uptime
Backed by AMD’s legacy of server innovation, the EPYC 7313P delivers secure, stable, and predictable compute performance—so your infrastructure keeps running, even when the workloads surge.

SKU 100-000000339
EAN 8592978317959
Manufacturer AMD
Availability Y
Processor
Processor base frequency3 GHz
Processor manufacturerAMD
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Processor cache128 MB
Processor model7313P
Processor threads32
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores16
Processor socketSocket SP3
Configurable TDP-up180 W
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Power
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)155 W
Market segmentServer
Configurable TDP-up180 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)155 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Configurable TDP-up180 W
Logistics data
Harmonized System (HS) code85423119