HPE Intel Xeon-Silver 4214R processor 2.4 GHz 16.5 MB Tray

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  • Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) FIO Processor Kit for HPE Apollo 4200 Gen10
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SKU #: P19707-B21
EAN #: 0190017438900
UNSPSC #: 43201503
More Information
Processor socket LGA 3647 (Socket P)
Box No
Processor cores 12
Processor family Intel Xeon Silver
SKU P19707-B21
EAN 0190017438900
Manufacturer HPE
Availability Out of Stock
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.4 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)100 W
Processor cache16.5 MB
Processor model4214R
Processor threads24
System bus rate9.6 GT/s
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores12
Processor socketLGA 3647 (Socket P)
Package typeTray
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)100 W
Technical details
PCI Express slots version3.0
Scalability2S
Thermal Design Power (TDP)100 W
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)100 W
PCI Express slots version3.0
Scalability2S
Packaging data
Package typeTray
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.4 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)100 W
Processor cache16.5 MB
Processor model4214R
Processor threads24
System bus rate9.6 GT/s
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores12
Processor socketLGA 3647 (Socket P)
Package typeTray
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)100 W
Technical details
PCI Express slots version3.0
Scalability2S
Thermal Design Power (TDP)100 W
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)100 W
PCI Express slots version3.0
Scalability2S
Packaging data
Package typeTray