HPE Intel Xeon-Platinum 8352M 2.3GHz 32-core 185W Processor Kit for Apollo 4200 Gen10 Plus

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  • Intel Xeon-Platinum 8352M 2.3GHz 32-core 185W Processor Kit for HPE Apollo 4200 Gen10 Plus
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SKU #: P45886-B21
EAN #: 0190017617558
UNSPSC #: 43201503
More Information
Processor socket LGA 4189
Box No
Processor cores 32
Processor family Intel Xeon Platinum
SKU P45886-B21
EAN 0190017617558
Manufacturer HPE
Availability Out of Stock
Processor
Processor base frequency2.3 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameIce Lake
Thermal Design Power (TDP)185 W
Processor cache48 MB
Processor model8352M
Processor threads64
System bus rate11.2 GT/s
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Processor lithography10 nm
Processor familyIntel® Xeon® Platinum
Processor cores32
Processor socketLGA 4189
Processor cache typeL3
Package typeTray
Memory
Maximum internal memory supported by processor6.14 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)185 W
Technical details
PCI Express slots version4.0
Scalability2S
Thermal Design Power (TDP)185 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)185 W
PCI Express slots version4.0
Scalability2S
Market segmentServer
Packaging data
Package typeTray
.
Processor
Processor base frequency2.3 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameIce Lake
Thermal Design Power (TDP)185 W
Processor cache48 MB
Processor model8352M
Processor threads64
System bus rate11.2 GT/s
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Processor lithography10 nm
Processor familyIntel® Xeon® Platinum
Processor cores32
Processor socketLGA 4189
Processor cache typeL3
Package typeTray
Memory
Maximum internal memory supported by processor6.14 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)185 W
Technical details
PCI Express slots version4.0
Scalability2S
Thermal Design Power (TDP)185 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)185 W
PCI Express slots version4.0
Scalability2S
Market segmentServer
Packaging data
Package typeTray