HPE Intel Xeon Platinum 8276M processor 2.2 GHz 38.5 MB L3 Tray

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  • ML350 Gen10 Intel Xeon-Platinum 8276M (2.2GHz/28-core/165W) Processor Kit
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SKU #: P10962-B21#0D1
UNSPSC #: 43201503
More Information
Processor socket LGA 3647 (Socket P)
Box No
Processor cores 28
Processor family Intel Xeon Platinum
SKU P10962-B21#0D1
Manufacturer HPE
Availability Out of Stock
Processor
Processor base frequency2.2 GHz
Processor manufacturerIntel
Cooler includedNo
Thermal Design Power (TDP)165 W
Processor cache38.5 MB
Processor model8276M
Processor threads56
System bus rate10.4 GT/s
Processor operating modes64-bit
Processor boost frequency4 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Platinum
Processor cores28
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Package typeTray
Memory
Maximum internal memory supported by processor2 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)165 W
Technical details
PCI Express slots version3.0
Thermal Design Power (TDP)165 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)165 W
PCI Express slots version3.0
Market segmentServer
Packaging data
Package typeTray
Processor
Processor base frequency2.2 GHz
Processor manufacturerIntel
Cooler includedNo
Thermal Design Power (TDP)165 W
Processor cache38.5 MB
Processor model8276M
Processor threads56
System bus rate10.4 GT/s
Processor operating modes64-bit
Processor boost frequency4 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Platinum
Processor cores28
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Package typeTray
Memory
Maximum internal memory supported by processor2 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)165 W
Technical details
PCI Express slots version3.0
Thermal Design Power (TDP)165 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)165 W
PCI Express slots version3.0
Market segmentServer
Packaging data
Package typeTray