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HPE Intel Xeon-Gold 6354 3.0GHz 18-core 205W Processor Kit for Apollo 4200 Gen10 Plus
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- Intel Xeon-Gold 6354 3.0GHz 18-core 205W Processor Kit for HPE Apollo 4200 Gen10 Plus
SKU #: P42923-B21
EAN #: 0190017531984
UNSPSC #: 43201503
| Processor socket | LGA 4189 |
|---|---|
| Box | No |
| Processor cores | 18 |
| Processor family | Intel Xeon Gold |
| SKU | P42923-B21 |
| EAN | 0190017531984 |
| Manufacturer | HPE |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor model | 6354 |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Processor socket | LGA 4189 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |
.
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor model | 6354 |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Processor socket | LGA 4189 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |