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HPE Intel Xeon-Gold 6256 processor 3.6 GHz 33 MB L3 Tray
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- HPE Intel Xeon-Gold 6256
- Intel® Xeon® Gold
- LGA 3647 (Socket P)
- 14 nm
- Tray
SKU #: P27657-B22
EAN #: 0190017450834
UNSPSC #: 43201503
Processor socket | LGA 3647 (Socket P) |
---|---|
Box | No |
Processor cores | 12 |
Processor family | Intel Xeon Gold |
SKU | P27657-B22 |
EAN | 0190017450834 |
Manufacturer | HPE |
Availability | Out of Stock |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.6 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 33 MB |
Processor model | 6256 |
Processor threads | 24 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Package type | Tray |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
---|---|
Thermal Design Power (TDP) | 205 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | S4S |
Thermal Design Power (TDP) | 205 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
PCI Express slots version | 3.0 |
Scalability | S4S |
Market segment | Server |
Packaging data | |
Package type | Tray |
HPE Intel Xeon-Gold 6256. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1.02 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.6 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 33 MB |
Processor model | 6256 |
Processor threads | 24 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Package type | Tray |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
---|---|
Thermal Design Power (TDP) | 205 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | S4S |
Thermal Design Power (TDP) | 205 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
PCI Express slots version | 3.0 |
Scalability | S4S |
Market segment | Server |
Packaging data | |
Package type | Tray |