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HPE Intel Xeon‑Gold 6234 processor 3.3 GHz 24.75 MB
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- Intel Xeon‑Gold 6234 (3.3GHz/8‑core/130W) Processor Kit for HPE ProLiant DL360 Gen10
SKU #: P02604-L21
EAN #: 0190017271200
UNSPSC #: 43201503
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Processor cores | 8 |
| Processor family | Intel Xeon Gold |
| Processor lithography | 14 nm |
| SKU | P02604-L21 |
| EAN | 0190017271200 |
| Manufacturer | HPE |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor base frequency | 3.3 GHz |
| Processor manufacturer | Intel |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 24.75 MB |
| Processor model | 6234 |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 130 W |
| Supported memory types | DDR4-SDRAM |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 79 °C |
| Weight & dimensions | |
| Width | 198.6 mm |
| Weight | 770 g |
| Height | 25.4 mm |
| Depth | 281.9 mm |
| Other features | |
| Maximum internal memory | 1 TB |
| Processor | |
|---|---|
| Processor base frequency | 3.3 GHz |
| Processor manufacturer | Intel |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 24.75 MB |
| Processor model | 6234 |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 130 W |
| Supported memory types | DDR4-SDRAM |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 79 °C |
| Weight & dimensions | |
| Width | 198.6 mm |
| Weight | 770 g |
| Height | 25.4 mm |
| Depth | 281.9 mm |
| Other features | |
| Maximum internal memory | 1 TB |