HPE Intel Xeon-Gold 6230N processor 2.3 GHz 27.5 MB Tray

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  • Intel Xeon-Gold 6230N (2.3GHz/20-core/125W) Processor Kit for HPE Synergy 480/660 Gen10
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SKU #: P08919-B21#0D1
UNSPSC #: 43201503
More Information
Processor socket LGA 3647 (Socket P)
Box No
Processor cores 20
Processor family Intel Xeon Gold
SKU P08919-B21#0D1
Manufacturer HPE
Availability Out of Stock
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.3 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)125 W
Processor cache27.5 MB
Processor model6230N
Processor threads40
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores20
Processor socketLGA 3647 (Socket P)
Package typeTray
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)125 W
Technical details
Execute Disable BitYes
PCI Express slots version3.0
Scalability4S
Thermal Design Power (TDP)125 W
Market segmentServer
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)125 W
Execute Disable BitYes
PCI Express slots version3.0
Scalability4S
Market segmentServer
Packaging data
Package typeTray
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.3 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)125 W
Processor cache27.5 MB
Processor model6230N
Processor threads40
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores20
Processor socketLGA 3647 (Socket P)
Package typeTray
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)125 W
Technical details
Execute Disable BitYes
PCI Express slots version3.0
Scalability4S
Thermal Design Power (TDP)125 W
Market segmentServer
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)125 W
Execute Disable BitYes
PCI Express slots version3.0
Scalability4S
Market segmentServer
Packaging data
Package typeTray