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HPE Intel Xeon-Gold 5317 processor 3 GHz 18 MB Tray
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- Intel Xeon-Gold 5317 3.0GHz 12-core 150W Processor for
SKU #: P36931-B21#0D1
UNSPSC #: 43201503
Processor socket | LGA 4189 |
---|---|
Box | No |
Processor cores | 12 |
Processor family | Intel Xeon Gold |
SKU | P36931-B21#0D1 |
Manufacturer | HPE |
Availability | Out of Stock |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 150 W |
Processor cache | 18 MB |
Processor model | 5317 |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 4189 |
Package type | Tray |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
---|---|
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Packaging data | |
Package type | Tray |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 150 W |
Processor cache | 18 MB |
Processor model | 5317 |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 4189 |
Package type | Tray |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
---|---|
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Packaging data | |
Package type | Tray |