HPE Intel Xeon-Gold 5317 processor 3 GHz 18 MB Tray

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  • Intel Xeon-Gold 5317 3.0GHz 12-core 150W Processor for
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SKU #: P36931-B21#0D1
UNSPSC #: 43201503
More Information
Processor socket LGA 4189
Box No
Processor cores 12
Processor family Intel Xeon Gold
SKU P36931-B21#0D1
Manufacturer HPE
Availability Out of Stock
Processor
Processor generation3rd Generation Intel® Xeon® Scalable
Processor base frequency3 GHz
Processor manufacturerIntel
Cooler includedNo
Thermal Design Power (TDP)150 W
Processor cache18 MB
Processor model5317
Processor threads24
Processor operating modes64-bit
Processor boost frequency3.6 GHz
Component forServer/workstation
Processor lithography10 nm
Processor familyIntel® Xeon® Gold
Processor cores12
Processor socketLGA 4189
Package typeTray
Memory
Maximum internal memory supported by processor6.14 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)150 W
Technical details
PCI Express slots version4.0
Scalability2S
Thermal Design Power (TDP)150 W
Market segmentServer
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)150 W
PCI Express slots version4.0
Scalability2S
Market segmentServer
Packaging data
Package typeTray
Processor
Processor generation3rd Generation Intel® Xeon® Scalable
Processor base frequency3 GHz
Processor manufacturerIntel
Cooler includedNo
Thermal Design Power (TDP)150 W
Processor cache18 MB
Processor model5317
Processor threads24
Processor operating modes64-bit
Processor boost frequency3.6 GHz
Component forServer/workstation
Processor lithography10 nm
Processor familyIntel® Xeon® Gold
Processor cores12
Processor socketLGA 4189
Package typeTray
Memory
Maximum internal memory supported by processor6.14 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)150 W
Technical details
PCI Express slots version4.0
Scalability2S
Thermal Design Power (TDP)150 W
Market segmentServer
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)150 W
PCI Express slots version4.0
Scalability2S
Market segmentServer
Packaging data
Package typeTray