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HPE Intel Xeon Gold 5217 processor 3 GHz 11 MB Smart Cache
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- Synergy 480/660 Gen10 Intel Xeon-Gold 5217 (3.0GHz/8-core/115W) FIO Processor Kit
SKU #: P07339-L21
UNSPSC #: 43201503
Processor socket | LGA 3647 (Socket P) |
---|---|
Processor cores | 8 |
Processor family | Intel Xeon Gold |
Processor lithography | 14 nm |
SKU | P07339-L21 |
Manufacturer | HPE |
Availability | Out of Stock |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Thermal Design Power (TDP) | 115 W |
Processor cache | 11 MB |
Processor model | 5217 |
Processor threads | 16 |
Processor operating modes | 32-bit, 64-bit |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor series | Intel Xeon Gold 5000 Series |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 1 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 115 W |
Technical details | |
---|---|
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 4S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 115 W |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 115 W |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 4S |
Embedded options available | No |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 79 °C |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Thermal Design Power (TDP) | 115 W |
Processor cache | 11 MB |
Processor model | 5217 |
Processor threads | 16 |
Processor operating modes | 32-bit, 64-bit |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor series | Intel Xeon Gold 5000 Series |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 1 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 115 W |
Technical details | |
---|---|
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 4S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 115 W |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 115 W |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 4S |
Embedded options available | No |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 79 °C |