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HPE Intel Xeon 8168 processor 2.7 GHz 33 MB L3
xOut of Stock
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- Intel Xeon Platinum 8168
- 33M Cache
- 2.7 GHz
- 205 W TDP
- FCLGA3647
SKU #: 878665-L21
EAN #: 0190017212777
UNSPSC #: 43201503
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Processor cores | 24 |
| Processor family | Intel Xeon Platinum |
| Processor lithography | 14 nm |
| SKU | 878665-L21 |
| EAN | 0190017212777 |
| Manufacturer | HPE |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.7 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 33 MB |
| Processor model | 8168 |
| Processor threads | 48 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 24 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Platinum 8000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
|---|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Processor series | Intel Xeon Platinum 8000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 85 °C |
| Other features | |
| Compatibility | ML350 GEN10 |
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| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.7 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 33 MB |
| Processor model | 8168 |
| Processor threads | 48 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 24 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Platinum 8000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
|---|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Processor series | Intel Xeon Platinum 8000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 85 °C |
| Other features | |
| Compatibility | ML350 GEN10 |