HPE EPYC 7552 processor 2.2 GHz 192 MB L3 Tray

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  • AMD EPYC 7552 2.2 GHz 48-core 200 W processor kit for HPE Apollo 6500 Gen10 Plus
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SKU #: P27253-B21
EAN #: 0190017465791
UNSPSC #: 43201503
More Information
Processor socket Socket SP3
Box No
Processor cores 48
Processor family AMD EPYC
SKU P27253-B21
EAN 0190017465791
Manufacturer HPE
Availability Out of Stock
Product Family EPYC
Processor
Processor base frequency2.2 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)200 W
Processor cache192 MB
Processor model7552
Processor threads96
Processor operating modes32-bit
Processor boost frequency3.3 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores48
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)200 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)200 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)200 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor base frequency2.2 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)200 W
Processor cache192 MB
Processor model7552
Processor threads96
Processor operating modes32-bit
Processor boost frequency3.3 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores48
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)200 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)200 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)200 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119