HPE EPYC 7532 processor 2.4 GHz 256 MB L3 Tray

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  • AMD EPYC 7532 2.4 GHz 32-core 200 W processor kit for HPE Apollo 6500 Gen10 Plus
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SKU #: P27256-B21
EAN #: 0190017465821
UNSPSC #: 43201503
More Information
Processor socket Socket SP3
Box No
Processor cores 32
Processor family AMD EPYC
SKU P27256-B21
EAN 0190017465821
Manufacturer HPE
Availability Out of Stock
Product Family EPYC
Processor
Processor base frequency2.4 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)200 W
Processor cache256 MB
Processor model7532
Processor threads64
Processor operating modes64-bit
Processor boost frequency3.3 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores32
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)200 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)200 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)200 W
PCI Express slots version4.0
Market segmentServer
Packaging data
Package typeTray
Processor
Processor base frequency2.4 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)200 W
Processor cache256 MB
Processor model7532
Processor threads64
Processor operating modes64-bit
Processor boost frequency3.3 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores32
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)200 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)200 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)200 W
PCI Express slots version4.0
Market segmentServer
Packaging data
Package typeTray