HPE AMD EPYC 7742 processor 2.25 GHz 256 MB L3 Tray

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  • DL385 Gen10 Plus AMD EPYC 7742 (2.3 GHz/64-core/225 W) FIO Processor Kit
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SKU #: P21630-L21
EAN #: 0190017423487
UNSPSC #: 43201503
More Information
Processor socket Socket SP3
Box No
Processor cores 64
Processor family AMD EPYC
SKU P21630-L21
EAN 0190017423487
Manufacturer HPE
Availability Out of Stock
Processor
Processor base frequency2.25 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)225 W
Processor cache256 MB
Processor model7742
Processor threads128
Processor operating modes64-bit
Processor boost frequency3.4 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores64
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)225 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)225 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)225 W
PCI Express slots version4.0
Market segmentServer
Packaging data
Package typeTray
Processor
Processor base frequency2.25 GHz
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)225 W
Processor cache256 MB
Processor model7742
Processor threads128
Processor operating modes64-bit
Processor boost frequency3.4 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores64
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)225 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)225 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)225 W
PCI Express slots version4.0
Market segmentServer
Packaging data
Package typeTray