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HPE AMD EPYC 7702 processor 2 GHz 256 MB L3 Tray
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- AMD EPYC 7702 (2.0GHz/64-core/200W) Field Upgrade Processor Kit for ProLiant DL385 Gen10
SKU #: P16659-B21
EAN #: 0190017364087
UNSPSC #: 43201503
Processor socket | Socket SP3 |
---|---|
Box | No |
Processor cores | 64 |
Processor family | AMD EPYC |
SKU | P16659-B21 |
EAN | 0190017364087 |
Manufacturer | HPE |
Availability | Out of Stock |
Processor | |
---|---|
Processor base frequency | 2 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 200 W |
Processor cache | 256 MB |
Processor model | 7702 |
Processor threads | 128 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 64 |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Package type | Tray |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 200 W |
Technical details | |
---|---|
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 200 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 200 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Packaging data | |
Package type | Tray |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 200 W |
Processor cache | 256 MB |
Processor model | 7702 |
Processor threads | 128 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 64 |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Package type | Tray |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 200 W |
Technical details | |
---|---|
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 200 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 200 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Packaging data | |
Package type | Tray |
Logistics data | |
Harmonized System (HS) code | 85423119 |