HPE AMD EPYC 7702 processor 2 GHz 256 MB L3

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  • HPE AMD EPYC 7702
  • AMD EPYC
  • Socket SP3
  • AMD
  • 2 GHz
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SKU #: P39373-B21
EAN #: 0190017489063
UNSPSC #: 43201503
More Information
Processor socket Socket SP3
Processor cores 64
Processor family AMD EPYC
SKU P39373-B21
EAN 0190017489063
Manufacturer HPE
Availability Out of Stock
Processor
Processor base frequency2 GHz
Processor manufacturerAMD
Thermal Design Power (TDP)200 W
Processor cache256 MB
Processor model7702
Processor threads128
Processor boost frequency3.35 GHz
Processor familyAMD EPYC
Processor cores64
Processor socketSocket SP3
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Power
Thermal Design Power (TDP)200 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)200 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)200 W
PCI Express slots version4.0
Harmonized System (HS) code85423119
I/O configuration
USB version3.2 Gen 1 (3.1 Gen 1)
USB ports quantity4
Total number of SATA connectors32
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Width223 mm
Weight410 g
Height361 mm
Depth287 mm
HPE AMD EPYC 7702. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. USB version: 3.2 Gen 1 (3.1 Gen 1). Width: 223 mm, Depth: 287 mm, Height: 361 mm
Processor
Processor base frequency2 GHz
Processor manufacturerAMD
Thermal Design Power (TDP)200 W
Processor cache256 MB
Processor model7702
Processor threads128
Processor boost frequency3.35 GHz
Processor familyAMD EPYC
Processor cores64
Processor socketSocket SP3
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Power
Thermal Design Power (TDP)200 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)200 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)200 W
PCI Express slots version4.0
Harmonized System (HS) code85423119
I/O configuration
USB version3.2 Gen 1 (3.1 Gen 1)
USB ports quantity4
Total number of SATA connectors32
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Width223 mm
Weight410 g
Height361 mm
Depth287 mm