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HPE AMD EPYC 7662 processor 2 GHz 256 MB L3 Tray
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- AMD EPYC 7662 (2.0GHz/64-core/225W) FIO Processor Kit for ProLiant DL385 Gen10 Plus
SKU #: P25590-L21
EAN #: 0190017444611
UNSPSC #: 43201503
| Processor socket | Socket SP3 |
|---|---|
| Box | No |
| Processor cores | 64 |
| Processor family | AMD EPYC |
| SKU | P25590-L21 |
| EAN | 0190017444611 |
| Manufacturer | HPE |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor base frequency | 2 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 225 W |
| Processor cache | 256 MB |
| Processor model | 7662 |
| Processor threads | 128 |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 64 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 225 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 225 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 225 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |
| Processor | |
|---|---|
| Processor base frequency | 2 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 225 W |
| Processor cache | 256 MB |
| Processor model | 7662 |
| Processor threads | 128 |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 64 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 225 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 225 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 225 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |