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HPE AMD EPYC 7643 2.3GHz 48-core 225W Processor Kit for ProLiant XL225n Gen10 Plus
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- AMD EPYC 7643 2.3GHz 48-core 225W Processor Kit for HPE ProLiant XL225n Gen10 Plus
SKU #: P39472-B21
EAN #: 0190017500881
UNSPSC #: 43201503
Processor socket | Socket SP3 |
---|---|
Processor cores | 48 |
Processor family | AMD EPYC |
SKU | P39472-B21 |
EAN | 0190017500881 |
Manufacturer | HPE |
Availability | Out of Stock |
Processor | |
---|---|
Processor base frequency | 2.3 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 225 W |
Processor cache | 256 MB |
Processor model | 7643 |
Processor threads | 96 |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 48 |
Processor socket | Socket SP3 |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Thermal Design Power (TDP) | 225 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 225 W |
Market segment | Server |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Features | |
---|---|
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 225 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 240 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Width | 174.8 mm |
Weight | 700 g |
Height | 169.7 mm |
Depth | 285.7 mm |
.
Processor | |
---|---|
Processor base frequency | 2.3 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 225 W |
Processor cache | 256 MB |
Processor model | 7643 |
Processor threads | 96 |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 48 |
Processor socket | Socket SP3 |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Thermal Design Power (TDP) | 225 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 225 W |
Market segment | Server |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Features | |
---|---|
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 225 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 240 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Width | 174.8 mm |
Weight | 700 g |
Height | 169.7 mm |
Depth | 285.7 mm |