HPE AMD EPYC 7402 processor 128 MB L3 Tray

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  • AMD EPYC 7402 (2.8GHz/24-core/180-200W) Field Upgrade Processor Kit for ProLiant DL385 Gen10
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SKU #: P16663-B21
EAN #: 0190017364124
UNSPSC #: 43201503
More Information
Processor socket Socket SP3
Box No
Processor cores 24
Processor family AMD EPYC
SKU P16663-B21
EAN 0190017364124
Manufacturer HPE
Availability Out of Stock
Processor
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)180 W
Processor cache128 MB
Processor model7402
Processor threads48
Processor operating modes64-bit
Processor boost frequency3.35 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores24
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)180 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)180 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)180 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Processor
Processor manufacturerAMD
Cooler includedNo
Thermal Design Power (TDP)180 W
Processor cache128 MB
Processor model7402
Processor threads48
Processor operating modes64-bit
Processor boost frequency3.35 GHz
Component forServer/workstation
Processor lithography7 nm
Processor familyAMD EPYC
Processor cores24
Processor socketSocket SP3
Processor cache typeL3
Package typeTray
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)180 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)180 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)180 W
PCI Express slots version4.0
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119