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HPE AMD EPYC 7302 processor 3 GHz 128 MB L3 Tray
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- DL385 Gen10 AMD EPYC 7302 (3.0 GHz/16-core/155-180 W) FIO processor kit
SKU #: P16643-L21
UNSPSC #: 43201503
| Processor socket | Socket SP3 |
|---|---|
| Box | No |
| Processor cores | 16 |
| Processor family | AMD EPYC |
| SKU | P16643-L21 |
| Manufacturer | HPE |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |