HP Intel Xeon Silver 4210R processor 2.4 GHz 13.75 MB Tray

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  • Intel Xeon Silver 4210R Processor
  • 13.75MB Cache
  • up to 3.2 GHz
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SKU #: 8JJ07AV
UNSPSC #: 43201503
More Information
Processor socket LGA 3647 (Socket P)
Box No
Processor cores 10
Processor family Intel Xeon Silver
SKU 8JJ07AV
Manufacturer HP
Availability Out of Stock
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.4 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)100 W
Processor cache13.75 MB
Processor model4210R
Processor threads20
Processor operating modes64-bit
Processor boost frequency3.2 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores10
Processor socketLGA 3647 (Socket P)
Package typeTray
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)100 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableYes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)100 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units1
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)100 W
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability2S
Embedded options availableYes
Market segmentServer
PCI Express CEM revision3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units1
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)No
Intel® Optane™ DC Persistent Memory SupportedNo
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyNo
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® vPro™ Platform EligibilityYes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)No
Intel® Transactional Synchronization ExtensionsYes
Operational conditions
Tcase84 °C
Packaging data
Package typeTray
Options, accessories, services and support for all your HP and Compaq products.
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.4 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)100 W
Processor cache13.75 MB
Processor model4210R
Processor threads20
Processor operating modes64-bit
Processor boost frequency3.2 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores10
Processor socketLGA 3647 (Socket P)
Package typeTray
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)100 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableYes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)100 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units1
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)100 W
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability2S
Embedded options availableYes
Market segmentServer
PCI Express CEM revision3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units1
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)No
Intel® Optane™ DC Persistent Memory SupportedNo
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyNo
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® vPro™ Platform EligibilityYes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)No
Intel® Transactional Synchronization ExtensionsYes
Operational conditions
Tcase84 °C
Packaging data
Package typeTray