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HP Intel Xeon Gold 6144 processor 3.5 GHz 24.75 MB L3
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- Intel Xeon Gold 6144
- 24.75M Cache
- 3.5 GHz
- 150 W TDP
- FCLGA3647
SKU #: 2RX96AA
EAN #: 0191628850396
UNSPSC #: 43201503
Processor socket | LGA 3647 (Socket P) |
---|---|
Processor cores | 8 |
Processor family | Intel Xeon Gold |
Processor lithography | 14 nm |
SKU | 2RX96AA |
EAN | 0191628850396 |
Manufacturer | HP |
Availability | Out of Stock |
Processor | |
---|---|
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 3.5 GHz |
Cooler included | No |
Processor codename | Skylake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 24.75 MB |
Processor model | 6144 |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.2 GHz |
Stepping | H0 |
Bus type | UPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor series | Intel Xeon Gold 6000 Series |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S4S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 150 W |
Processor series | Intel Xeon Gold 6000 Series |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
---|---|
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S4S |
Embedded options available | No |
HP segment | Business |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 75 °C |
Packaging data | |
Package width | 399 mm |
Package depth | 203 mm |
Package height | 156 mm |
Weight & dimensions | |
Package width | 399 mm |
Package depth | 203 mm |
Package height | 156 mm |
Bring digital content creations to life with the reinvented Intel® Xeon® Scalable processors[1], available in four feature configurations—Platinum, Gold, Silver, and Bronze—to address your specific workstation deployment in VR and AR, content creation, CAD, and simulations.
Processor | |
---|---|
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 3.5 GHz |
Cooler included | No |
Processor codename | Skylake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 24.75 MB |
Processor model | 6144 |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.2 GHz |
Stepping | H0 |
Bus type | UPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor series | Intel Xeon Gold 6000 Series |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S4S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 150 W |
Processor series | Intel Xeon Gold 6000 Series |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
---|---|
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S4S |
Embedded options available | No |
HP segment | Business |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 75 °C |
Packaging data | |
Package width | 399 mm |
Package depth | 203 mm |
Package height | 156 mm |
Weight & dimensions | |
Package width | 399 mm |
Package depth | 203 mm |
Package height | 156 mm |