This site uses cookies and other tracking technologies to assist with navigation and your ability to provide feedback, analyse your use of our site and services and assist with our promotional and marketing efforts. You can read more about this in our Privacy Policy.
AMD Ryzen 9 9950X3D processor 4.3 GHz 144 MB L2 & L3 Box
xOut of Stock
Contact your account manager
- AMD Ryzen 9 9950X3D Gaming and Content Creation Processor
- Boxed
SKU #: 100-100000719WOF
EAN #: 0730143315555
UNSPSC #: 43201503
The ultimate 16-core desktop CPU with 2nd gen AMD 3D V-Cache™ Technology that can do it all with incredible performance for the most demanding gamers and creators.
SKU | 100-100000719WOF |
---|---|
EAN | 0730143315555 |
Manufacturer | AMD |
In Stock | N |
Processor | |
---|---|
Processor generation | AMD Ryzen 9000 Series |
Processor base frequency | 4.3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 170 W |
Processor cache | 144 MB |
Processor model | 9950X3D |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 5.7 GHz |
Processor lithography | 4 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket AM5 |
Processor cache type | L2 & L3 |
Memory | |
Maximum internal memory supported by processor | 192 GB |
Memory types supported by processor | DDR5-SDRAM |
Memory clock speeds supported by processor | 3600,5600 MHz |
Memory channels | Dual-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | AMD Radeon Graphics |
On-board graphics card | Yes |
On-board graphics card base frequency | 2200 MHz |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 170 W |
Technical details | |
---|---|
PCI Express slots version | 5.0 |
Supported instruction sets | AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 |
Thermal Design Power (TDP) | 170 W |
Market segment | Desktop |
Processor cache type | L2 & L3 |
Features | |
Maximum number of PCI Express lanes | 28 |
Thermal Design Power (TDP) | 170 W |
PCI Express slots version | 5.0 |
Supported instruction sets | AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 |
Market segment | Desktop |
I/O configuration | |
USB version | 3.2 Gen 2 (3.1 Gen 2) |
USB ports quantity | 4 |
Operational conditions | |
Minimum operating temperature | 95 °C |