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Lenovo 4XC1V60972 network card Internal WWAN
xOut of Stock
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- ThinkPad Foxconn SDX61 5G Sub6 PCIE M.2 3052 WWAN module for P1&T1g G9
SKU #: 4XC1V60972
EAN #: 0195892147060
UNSPSC #: 43201404
- Size: 52mm x 30mm x 2.3mm;
- Weight: approx. 8g;
- PCIe Gen3 1 Lane interface;
- Dual SIM Single Active (DSSA);
- Data rate: up to 7.2Gbps (Downlink)/ 5.76Gbps (Uplink)
| SKU | 4XC1V60972 |
|---|---|
| EAN | 0195892147060 |
| Manufacturer | Lenovo |
| Availability | Out of Stock |
| Ports & interfaces | |
|---|---|
| Internal | Yes |
| PCI version | 3.0 |
| Interface | WWAN |
| Host interface | PCI Express |
| Connectivity technology | Wireless |
| Technical details | |
| Compatible products | ThinkPad P1&T1g G9 |
| Network | |
| Mobile network generation | 5G |
| Design | |
| Compatible products | ThinkPad P1&T1g G9 |
| Certification | ENACOM, RCM, CE, TRA, ANATEL, ISED, SRRC, CTA, CCC, NTRA, SDPPI, TELEC, JATE, SIRIM, ANRT, MTC, NTC, IMDA, ICASA, KCC, NCC, NBTC, TDRA, FCC, URSEC, UCRT, CA |
| Internal | Yes |
| Form factor | M.2 3052 |
| Component for | Laptop |
| Software | |
| Windows operating systems supported | Windows 11 |
| System requirements | |
| Windows operating systems supported | Windows 11 |
| Operational conditions | |
|---|---|
| Operating temperature (T-T) | -30 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Width | 52 mm |
| Depth | 30 mm |
| Height | 2.3 mm |
| Weight | 65 g |
| Package width | 157 mm |
| Package depth | 58 mm |
| Package height | 17 mm |
| Package weight | 76 g |
| Packaging data | |
| Package width | 157 mm |
| Package depth | 58 mm |
| Package height | 17 mm |
| Package weight | 76 g |
| Performance | |
| Compatible products | ThinkPad P1&T1g G9 |
| Windows operating systems supported | Windows 11 |
| Certificates | |
| Certification | ENACOM, RCM, CE, TRA, ANATEL, ISED, SRRC, CTA, CCC, NTRA, SDPPI, TELEC, JATE, SIRIM, ANRT, MTC, NTC, IMDA, ICASA, KCC, NCC, NBTC, TDRA, FCC, URSEC, UCRT, CA |
| Other features | |
| Form factor | M.2 3052 |
ThinkPad Foxconn SDX61 5G Sub6 PCIE M.2 3052 WWAN module for P1&T1g G9 is compliant with PCIe in all modes. The SDX61 chipset supports 5G NR standard for sub-6 GHz bands high-speed data capabilities over a wide range of air interface standards. SDX61 5G 3052 WWAN module is the data card solution that operate on networks worldwide.
| Ports & interfaces | |
|---|---|
| Internal | Yes |
| PCI version | 3.0 |
| Interface | WWAN |
| Host interface | PCI Express |
| Connectivity technology | Wireless |
| Technical details | |
| Compatible products | ThinkPad P1&T1g G9 |
| Network | |
| Mobile network generation | 5G |
| Design | |
| Compatible products | ThinkPad P1&T1g G9 |
| Certification | ENACOM, RCM, CE, TRA, ANATEL, ISED, SRRC, CTA, CCC, NTRA, SDPPI, TELEC, JATE, SIRIM, ANRT, MTC, NTC, IMDA, ICASA, KCC, NCC, NBTC, TDRA, FCC, URSEC, UCRT, CA |
| Internal | Yes |
| Form factor | M.2 3052 |
| Component for | Laptop |
| Software | |
| Windows operating systems supported | Windows 11 |
| System requirements | |
| Windows operating systems supported | Windows 11 |
| Operational conditions | |
|---|---|
| Operating temperature (T-T) | -30 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Width | 52 mm |
| Depth | 30 mm |
| Height | 2.3 mm |
| Weight | 65 g |
| Package width | 157 mm |
| Package depth | 58 mm |
| Package height | 17 mm |
| Package weight | 76 g |
| Packaging data | |
| Package width | 157 mm |
| Package depth | 58 mm |
| Package height | 17 mm |
| Package weight | 76 g |
| Performance | |
| Compatible products | ThinkPad P1&T1g G9 |
| Windows operating systems supported | Windows 11 |
| Certificates | |
| Certification | ENACOM, RCM, CE, TRA, ANATEL, ISED, SRRC, CTA, CCC, NTRA, SDPPI, TELEC, JATE, SIRIM, ANRT, MTC, NTC, IMDA, ICASA, KCC, NCC, NBTC, TDRA, FCC, URSEC, UCRT, CA |
| Other features | |
| Form factor | M.2 3052 |
